The XPedite2770 is a heterogeneous compute platform that combines two ARM® Cortex®-A72 application cores, two Cortex®-R5F real-time cores, and a Network-on-Chip (NoC) interconnect with a large FPGA fabric to support demanding signal and data processing workloads. With 16 GB of LPDDR4 ECC SDRAM and up to 256 GB of onboard NAND flash, the XPedite2770 is ideal for bandwidth-intensive applications.
Dual x4 PCIe Gen3 interfaces, dual Gigabit Ethernet ports, LVDS, GPIO, and configurable serial interfaces provide flexible I/O for mission-critical systems. A dedicated XMC site offers expansion with an x8 PCIe link and X12d I/O routed to the VPX backplane. SOSA-aligned, the module supports slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and AMPS profile MODA3-16.2.15-1-F2C for integration into modular open systems.
To support rapid development, X-ES provides the Hardware Manager Development Kit (HMDK), which includes design resources, software libraries, and a complete FPGA development environment with U-Boot, Arm Trusted Firmware, Linux Yocto BSPs, and ready-to-use example designs tailored to the XPedite2770.
| Memory: | 16 GB LPDDR4 ECC (2 channels), up to 256 GB NAND Flash |
| Interfaces: | 2× x4 PCIe Gen3, 2× 10/100/1000BASE-T, LVDS, GPIO, RS-232/422/485 |
| Operating Temperature: | -40 to +85°C (board rail surface) |
| Storage Temperature: | -55 to +105°C |
| Vibration: | 0.1 g²/Hz (max), 5–2000 Hz |
| Shock: | 40 g, 11 ms sawtooth |
| Humidity: | Up to 95% non-condensing |
