FLIR AVP
The AVP is a low-SWaP system-on-module designed to run Teledyne FLIR's Prism AI software, providing enhanced features for thermal infrared and visible camera perception systems including detection, classification, target tracking and image enhancement. Based on the Qualcomm QCS8550, it includes 16GB of LPDDR5X memory and 256GB of unified memory. The offers up to 48 TOPS inference compute performance.
Providing six MIPI camera interfaces and one USB interface, it is ideal for unmanned systems and robotics, counter-UAS, security and ISR applications.
Specifications:
| Dimensions: | 40.27 x 33.41 mm LGA form factor |
| Weight: | 5 grams (without shield) |
| Processor: | Qualcomm QCS8550 64-bit Octa-Core Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU Qualcomm Adreno GPU 740 Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX) Qualcomm Secure Processing Unit for advanced secure use cases Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera |
| Memory/Storage: | 16GB LPDDR5x 256GB UFS 3.1 |
| Camera Interfaces: | Qualcomm Spectra ISP 6x 4-lane CSIs & 2x 2- lane CSIs D-PHY v1.2: 2.5 Gbps/lane C-PHY v2.0: 13.68 Gbps/trio |
| I/O Interfaces: | 1 x USB 3.1 Type C 1 x MicroSD Card 1 x MicroUSB for debug Console 2 x PCIe (1x PCIe 2-lane Gen 3, 1x PCIe 2-lane Gen 4) |
