Extreme Engineering Solutions (X-ES) provides rugged embedded computing solutions tailored to meet the demanding requirements of the defense industry.
One of the company’s standout offerings is the XPedite2770, a versatile and high-performance 3U VPX FPGA module designed for signal processing, data security, and complex processing tasks.
XPedite2770
The XPedite2770 is based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP), a next-generation processing architecture. This reconfigurable module offers a conduction-cooled design that ensures reliable performance in harsh environments.
Equipped with 16 GB of LPDDR4 ECC SDRAM, the XPedite2770 is optimized for high-bandwidth, signal-processing applications, making it ideal for use in advanced defense, aerospace, and telecommunications systems.
Security is a key consideration in many applications, and the XPedite2770 excels in this regard with its SecureCOTS™ technology. Featuring a Versal® Prime VM1402 ACAP, this module enables the hosting of custom functions to safeguard sensitive data against modification or unauthorized observation. For projects requiring stringent security measures, the XPedite2770 provides an ideal solution.
Heterogeneous Compute Platform for Defense Applications
The XPedite2770 is a heterogeneous compute platform designed to deliver exceptional performance across various processing tasks. It incorporates two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, and a large FPGA fabric, interconnected via a Network-on-Chip (NoC).
These specialized processing elements are perfect for high-bandwidth applications such as signal processing, packet processing, sensor I/O, DSP-intensive tasks, and next-generation 5G wireless infrastructure.
This module’s high-speed capabilities are further enhanced by two x4 PCI Express interfaces and two 10/100/1000BASE-T Ethernet ports. With the ability to accommodate up to 256 GB of onboard NAND flash, the XPedite2770 offers ample storage to handle large data sets and streaming data from multiple sensors.
Block Diagram
Expansion & I/O Flexibility
The XPedite2770 provides additional expansion capabilities with an integrated XMC site that features a x8 PCI Express connection to the Versal® Prime ACAP. The XMC site is equipped with X12d I/O mapped directly to the VPX backplane connectors, providing further flexibility for various applications.
Additionally, the module includes numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through backplane connectors. These ports facilitate seamless connectivity to external systems and components, further enhancing the module’s versatility.
Compatibility with SOSA Standards
The XPedite2770 is designed to meet the needs of modern defense and aerospace systems by offering a SOSA-aligned pinout that is compatible with the backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16. It also supports the SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N), ensuring compatibility with various system architectures and standards.
Streamlined Development with X-ES HMDK
To further enhance the development process, X-ES provides the Hardware Manager Development Kit (HMDK), a pre-validated environment designed for rapid application development.
This comprehensive kit includes a library of optimized IP, software components, and design resources, enabling engineers to quickly develop and deploy custom solutions.
The HMDK also comes with the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, FPGA Development Kit (FDK), Linux Yocto support, and example designs specifically for the XPedite2770.
