Teledyne FLIR OEM, in partnership with Sonim Technologies, has unveiled its Thermal by FLIR collaboration, introducing professional thermal imaging to the compact and rugged XP Pro Thermal smartphone.
The product features an integrated FLIR Lepton® radiometric thermal camera module and the MyFLIR Pro app, set to enhance field-ready mobile devices.
Designed for professionals who require reliability in challenging environments, the XP Pro Thermal combines Sonim’s well-known rugged engineering with advanced thermal capabilities. The device leverages the Qualcomm Snapdragon® 7 Gen 3 processor to deliver advanced performance and introduces cutting-edge features, including Teledyne FLIR’s patented MSX® technology, which overlays visible-light details onto thermal images for clarity and context.
Users can also access FLIR Thermal Studio software, enabling comprehensive inspection workflows and sophisticated data analysis for professional reporting. A thermal-capable ruggedized mobile phone first, Sonim’s XP Pro Thermal is carrier-adoption ready, making it more accessible for professionals and consumers alike.
Furthermore, Teleydyne FLIR OEM claims its size and form factor make the XP Pro Thermal the world’s thinnest ultra-rugged smartphone featuring a FLIR Lepton camera module while still delivering all the protection from the elements professionals expect.
Through the Thermal by FLIR program, collaborators can gain access to advanced thermal imaging technology, accelerated development support, and comprehensive go-to-market assistance. This innovative program helps manufacturers integrate Teledyne FLIR OEM thermal camera modules while minimizing development costs and speeding the time to market.
Mike Walters, vice president, product development, Teledyne FLIR OEM, stated, “Sonim has engineered a consumer-sized platform that transforms how industrial professionals capture and process critical inspection data. As the thinnest rugged smartphone with Teledyne FLIR OEM professional-grade thermal capabilities, the XP Pro Thermal will transform expectations for rugged mobile devices.”
Michael Coad, senior vice president, product-phones, Sonim Technologies, also commented, “The Sonim XP Pro Thermal represents a new phase in our ruggedized handset development. With the Lepton 3.5 and mobile software development kit (SDK), we’ve created the ultimate carrier-adoption-ready rugged device.
“The Thermal by FLIR collaboration has been instrumental in rapidly bringing this innovative solution to market, delivering the combination of 5G and advanced thermal capabilities our customers need for enhanced situational awareness and decision making.”
